The 74LVC273-Q100 has eight edge-triggered, D-type flip-flops with individual Dn inputs and Qn outputs. The common clock (CP) and master reset (MR) inputs load and reset (clear) all flip-flops simultaneously. The state of each Dn input, one set-up time before the LOW-to-HIGH clock transition, is transferred to the corresponding output (Qn) of the flip-flop. All outputs are forced LOW independent of clock or data inputs by a LOW voltage level on the MR input.
The device is useful for applications where the true output only is required and the clock and master reset are common to all storage elements.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Name/Description | Modified Date |
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Octal D-type flip-flop with reset; positive-edge trigger (REV 1.0) PDF (130.0 kB) 74LVC273_Q100 | 16 Sep 2013 |
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Low voltage CMOS family - LVC (REV 1.0) PDF (2.6 MB) 75017668 | 10 Jul 2015 |
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plastic small outline package; 20 leads; body width 7.5 mm (REV 1.0) PDF (335.0 kB) SOT163-1 | 08 Feb 2016 |
plastic thin shrink small outline package; 20 leads; body width 4.4 mm (REV 1.0) PDF (304.0 kB) SOT360-1 | 08 Feb 2016 |
plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x... (REV 1.0) PDF (190.0 kB) SOT764-1 | 08 Feb 2016 |
Name/Description | Modified Date |
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DHVQFN20; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or... (REV 4.0) PDF (203.0 kB) SOT764-1_115 | 23 Apr 2013 |
SO20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 2.0) PDF (246.0 kB) SOT163-1_118 | 15 Apr 2013 |
TSSOP20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 4.0) PDF (225.0 kB) SOT360-1_118 | 15 Apr 2013 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE | 08 Oct 2009 |
Product | Status |
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74LVC273PW-Q100 | Active |
74LVC273D-Q100 | Active |
74LVC273BQ-Q100 | Active |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | MSL | MSL LF |
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74LVC273PW-Q100 | SOT360-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | 74LVC273PW-Q100J (9353 024 62118) | LVC273 | 74LVC273PW-Q100 | Always Pb-free | 123.8 | 1 | 1 | ||
74LVC273BQ-Q100 | SOT764-1 | Reel 7" Q1/T1 | Active | 74LVC273BQ-Q100X (9353 024 59115) | LVC273 | 74LVC273BQ-Q100 | Always Pb-free | 123.8 | 1 | 1 | |||
74LVC273D-Q100 | SOT163-1 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 13" Q1/T1 | Active | 74LVC273D-Q100J (9353 024 61118) | 74LVC273D | 74LVC273D-Q100 | Always Pb-free | 123.8 | 1 | 1 |