BAS16LD: Single high-speed switching diode
Single high-speed switching diode, encapsulated in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
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Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Single high-speed switching diode (REV 1.0) PDF (248.0 kB) BAS16LD | 18 Oct 2010 |
Brochures (2)
| Name/Description | Modified Date |
|---|---|
| NXP® SOD882D package, First leadless package with tin-plated, solderable side pads (REV 2.0) PDF (1.8 MB) 75017130 | 06 Jun 2011 |
| The first leadless package with solderable side pads (REV 1.0) PDF (228.0 kB) POSTER_SOD882D | 21 Oct 2010 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D | 08 Feb 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BAS16LD NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS16LD_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BAS16LD NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS16LD_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- BAS16L SPICE model (REV 2.4) TXT BAS16L 7/22/2012
- BAS16LD SPICE model (REV 1.1) prm BAS16LD_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | VR max (V) | VR [max] (V) | IFSM [max] (A) | IFSM max (A) | VF [max] (mV) | VFmax (mV) | IR [max] (nA) | IR max (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr max (ns) | trr [max] (ns) | IF max (mA) | IF [max] (mA) | Cd max. (pF) | Cd [max] (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS16LD | Active | SOD882D | DFN1006D-2 | 1 x 0.6 x 0.4 | 100 | 100 | 4 | 4 | 1000@IF=50mA | 1000@IF=50mA | 500@VR=80V | 500@VR=80V | 500 | 500 | single | 4 | 4 | 215 | 215 | 1.5 | 1.5 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS16LD | | SOD882D | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BAS16LD,315 (9340 645 65315) | 1000 0000 | BAS16LD |    | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
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