High-voltage switching diodes, encapsulated in a very small Surface-Mounted Device (SMD) plastic package.
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High-voltage switching diodes (REV 1.0) PDF (70.0 kB) BAS21W_SER | 12 Oct 2009 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 | 16 Nov 2012 |
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BAS21SW NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS21SW_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
BAS21SW NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS21SW_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | VR [max] (V) | VR max (V) | IFSM max (A) | IFSM [max] (A) | VFmax (mV) | VF [max] (mV) | IR [max] (nA) | IR max (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr max (ns) | trr [max] (ns) | IF [max] (mA) | IF max (mA) | Cd max. (pF) | Cd [max] (pF) |
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BAS21SW | Active | SOT323 | SC-70 | 2 x 1.25 x 0.95 | 200 | 200 | 9 | 9 | 1000@IF=100mA | 1000@IF=100mA | 100@VR=200V | 100@VR=200V | 625 | 625 | dual series | 50 | 50 | 225 | 225 | 2 | 2 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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BAS21SW | SOT323 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BAS21SW,115 (9340 632 71115) | X5% | BAS21SW | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |