BAS29: General purpose controlled avalanche (double) diodes
General purpose switching diodes fabricated in planar technology, and encapsulated in small rectangular plastic SMD SOT23 packages. The BAS29 consists of a single diode. The BAS31 has two diodes in series. The BAS35 has two diodes with a common anode.
BAS29: Product Block Diagram
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| General purpose controlled avalanche (double) diodes (REV 5.0) PDF (132.0 kB) BAS29_31_35 | 20 Mar 2003 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BAS29 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS29_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BAS29 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS29_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | VR [max] (V) | VR max (V) | IFSM [max] (A) | IFSM max (A) | VFmax (mV) | VF [max] (mV) | IR [max] (nA) | IR max (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr max (ns) | trr [max] (ns) | IF [max] (mA) | IF max (mA) | Cd max. (pF) | Cd [max] (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS29 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 90 | 90 | 10 | 10 | 1000@IF=200mA | 1000@IF=200mA | 100@VR=90V | 100@VR=90V | 600 | 600 | single | 50 | 50 | 250 | 250 | 35 | 35 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS29 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BAS29,215 (9337 231 80215) | %A8 | BAS29 |    | week 34, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS29 NXP Product Quality BAS29
- BAS29 NXP® Product Reliability BAS29
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- BAS29_BAS31_BAS35
- PMBFJ309
