BAS32L: High-speed switching diode
Single high-speed switching diode, fabricated in planar technology, and encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package.
BAS32L: Product Block Diagram
BAS32L: Block Diagram
sod080c_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| High-speed switching diode (REV 7.0) PDF (114.0 kB) BAS32L [English] | 24 Jan 2011 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Circuit description of CCM420 monitor (REV 1.0) PDF (501.0 kB) AN97032 [English] | 14 Oct 1997 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| hermetically sealed glass surface-mounted package; 2 connectors (REV 1.0) PDF (177.0 kB) SOD80C [English] | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (182.0 kB) SOD80C_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (182.0 kB) SOD80C_135 [English] | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BAS32L NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS32L_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS32L NXP® Product Reliability (REV 1.0) PDF (88.0 kB) BAS32L_NXP_PRODUCT_RELIABILITY [English] | 16 Jul 2014 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- BAS32L SPICE model (REV 1.4) prm BAS32L_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | VR max (V) | VR [max] (V) | IF max (mA) | IFSM [max] (A) | VF [max] (mV) | Configuration | IR [max] (nA) | trr max (ns) | IFRM (mA) | VFmax (mV) | IR max (nA) | trr [max] (ns) | IFSM max (A) | IFRM (mA) | IF [max] (mA) | Cd [max] (pF) | Cd max. (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS32L | Active | SOD80C | LLDS; MiniMelf | 3.5 x 1.5 | 75 | 75 | 200 | 4 | 1000@IF=100mA | single | 5000@VR=75V | 4 | 450 | 1000@IF=100mA | 5000@VR=75V | 4 | 4 | 450 | 200 | 2 | 2 |
| BAS32L/G | No Longer Manufactured | SOD80C | LLDS; MiniMelf | 3.5 x 1.5 | 75 | 75 | 200 | 4 | 1000@IF=100mA | single | 5000@VR=75V | 4 | 450 | 1000@IF=100mA | 5000@VR=75V | 4 | 4 | 450 | 200 | 2 | 2 |
| BAS32L/D | No Longer Manufactured | SOD80C | LLDS; MiniMelf | 3.5 x 1.5 | 75 | 75 | 200 | 4 | 1000@IF=100mA | single | 5000@VR=75V | 4 | 450 | 1000@IF=100mA | 5000@VR=75V | 4 | 4 | 450 | 200 | 2 | 2 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS32L | | SOD80C | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BAS32L,135 (9339 139 10135) | Standard Marking | BAS32L |   | 881.0 | 4.09 | 2.44E8 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BAS32L,115 (9339 139 10115) | Standard Marking | BAS32L | | 881.0 | 4.09 | 2.44E8 | 1 | 1 |
- High-speed switching diode BAS32L
- Circuit description of CCM420 monitor BAS321
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS32L NXP Product Quality BAS32L
- BAS32L NXP® Product Reliability BAS32L
- BAS32L SPICE model BAS32L
- SOD80C BZV55-C3V9
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reel 11¼" Q1/T1 in LargePack BZV55_SERIES
- Reel 7" Q1/T1 BZV55-C3V9
- BZV55_SERIES
