BAT54CM: Schottky barrier double diode
Planar Schottky barrier double diode encapsulated in a SOT883 leadless ultra small plastic package.
BAT54CM: Product Block Diagram
SOT883
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Schottky barrier double diode (REV 1.1) PDF (178.0 kB) BAT54CM | 11 Nov 2009 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 | 22 Jul 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BAT54CM NXP Product Quality (REV 1.2) PDF (74.0 kB) BAT54CM_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BAT54CM NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAT54CM_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- BAT54CM SPICE model (REV 1.4) prm BAT54CM_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAT54CM | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | 2 | dual c.c. | 800 | 0.6 | 10 | 30 | 200 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAT54CM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BAT54CM,315 (9340 572 52315) | S3 | BAT54CM |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Schottky barrier double diode BAT54CM
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAT54CM NXP Product Quality BAT54CM
- BAT54CM NXP® Product Reliability BAT54CM
- BAT54CM SPICE model BAT54CM
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- BAT54CM
- PMZ950UPE
