BC807DS: PNP general purpose double transistor
PNP transistor pair in a SOT457 (SC-74) plastic package.
BC807DS: Product Block Diagram
SOT457
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| PNP general purpose double transistor (REV 2.0) PDF (123.0 kB) BC807DS | 22 Nov 2002 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 | 30 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT457_135 | 30 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BC807DS NXP Product Quality (REV 1.2) PDF (74.0 kB) BC807DS_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BC807DS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC807DS_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 | 03 Jun 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE model
- BC807DS SPICE model (REV 1.4) prm BC807DS_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | hFE [min] | Configuration | IC max (mA) | hFE max | fr [min] (MHz) | Complement | IC [max] (mA) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | fT [min] (MHz) | hFE [max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC807DS | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 600 | 160 | 2 | BC817DS | -500 | PNP | 600 | -45 | 80 | 400 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC807DS | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BC807DS,115 (9340 573 18115) | N2 | BC807DS |    | week 22, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11¼" Q1/T1 in LargePack | Active | BC807DSF (9340 573 18135) | N2 | BC807DS | 153.0 | 0.71 | 1.41E9 |
- BC807DS NXP Product Quality BC807DS
- BC807DS NXP® Product Reliability BC807DS
- MAR_SOT457 Topmark 74LVC2G17_Q100
- Letter Symbols - Transistors; General PEMD16
- BC807DS SPICE model BC807DS
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- Tape reel SMD; standard product orientation 12NC ending 135 bza456a
- PIMT1
- SSL5021_SSL5031
