BC817-25: 45 V, 500 mA NPN general-purpose transistors
NPN general-purpose transistors.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 45 V, 500 mA NPN general-purpose transistors (REV 6.0) PDF (237.0 kB) BC817_BC817W_BC337 | 07 Dec 2009 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| BISS transistors and MEGA Schottky rectifiers - improved technologies for discrete semiconductors (REV 1.0) PDF (236.0 kB) AN10393 | 01 Sep 2005 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (3)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 185 (REV 1.0) PDF (214.0 kB) SOT23_185 | 16 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BC817-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817-25_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BC817-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC817-25_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE model
- BC817-25 SPICE model (REV 1.4) prm BC817-25 7/22/2012
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC817-25 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BC817-25,215 (9336 286 30215) | 6B% | BC817-25 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11" Q3/T4, LargePack | Active | BC817-25,235 (9336 286 30235) | 6B% | BC817-25 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC817-25/DG | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Withdrawn | BC817-25/DG,215 (9340 618 77215) | GN% | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BISS transistors and MEGA Schottky rectifiers - improved technologies for discrete semiconductors PMEG6010AED
- Tape reel SMD; standard product orientation 12NC ending 185 BAT54S
- BC817-25 NXP Product Quality BC817-25
- BC817-25 NXP® Product Reliability BC817-25
- Letter Symbols - Transistors; General PEMD16
- BC817-25 SPICE model BC817-25
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
