BC817-40: 45 V, 500 mA NPN general-purpose transistors _ BDTIC a Leading Distributor in China

BC817-40: 45 V, 500 mA NPN general-purpose transistors

NPN general-purpose transistors.

SOT023

Data Sheets (1)

Name/Description	Modified Date
45 V, 500 mA NPN general-purpose transistors (REV 6.0) PDF (237.0 kB) BC817_BC817W_BC337	07 Dec 2009

Application Notes (1)

Name/Description	Modified Date
BISS transistors and MEGA Schottky rectifiers - improved technologies for discrete semiconductors (REV 1.0) PDF (236.0 kB) AN10393	01 Sep 2005

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23	08 Feb 2016

Packing (3)

Name/Description	Modified Date
Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235	05 Feb 2013
Tape reel SMD; standard product orientation 12NC ending 185 (REV 1.0) PDF (214.0 kB) SOT23_185	16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215	16 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
BC817-40 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817-40_NXP_PRODUCT_QUALITY	31 Jan 2015
BC817-40 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC817-40_NXP_PRODUCT_RELIABILITY	31 Jan 2015

Supporting Information (2)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013

Design Support

Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999

SPICE model

BC817-40 SPICE model (REV 1.4) prm BC817-40 7/22/2012

Ordering Information

Product	Status	Package version	Package name	Size (mm)	hFE min	P_tot (mW)	fT min (MHz)	Configuration	V_CEO [max] (V)	Polarity	I_C max (mA)	h_FE [min]	VCEO max (V)	I_C [max] (mA)	h_FE [max]	Ptot max (mW)	f_T [min] (MHz)	Complement	f_r [min] (MHz)	hFE max
BC817-40	Active	SOT23	TO-236AB	2.9 x 1.3 x 1		250		1	45	NPN		250		500	600
BC817-40/A2	No Longer Manufactured	SOT23	TO-236AB	2.9 x 1.3 x 1		250		1	45	NPN		250		500	600
BC817-40/G	No Longer Manufactured	SOT23	TO-236AB	2.9 x 1.3 x 1		250		1	45	NPN		250		500	600

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
BC817-40		SOT23	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4	Active	BC817-40,215 (9336 286 40215)	6C%	BC817-40		week 34, 2003	153.0	0.71	1.41E9	1	1
BC817-40		SOT23		Reel 11" Q3/T4, LargePack	Active	BC817-40,235 (9336 286 40235)	6C%	BC817-40		week 34, 2003	153.0	0.71	1.41E9	1	1

45 V, 500 mA NPN general-purpose transistors BC817W

BISS transistors and MEGA Schottky rectifiers - improved technologies for discrete semiconductors PMEG6010AED

Tape reel SMD; standard product orientation 12NC ending 185 BAT54S

BC817-40 NXP Product Quality BC817-40

BC817-40 NXP® Product Reliability BC817-40

Letter Symbols - Transistors; General PEMD16

BC817-40 SPICE model BC817-40

plastic surface-mounted package; 3 leads BSS84AK

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK

Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK

PMBFJ309

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