BC846BMB: 65 V, 100 mA NPN general-purpose transistor
NPN general-purpose transistor in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package.
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Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 65 V, 100 mA NPN general-purpose transistor (REV 1.0) PDF (322.0 kB) BC846BMB | 22 May 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 | 22 Jul 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BC846BMB NXP Product Quality (REV 1.2) PDF (74.0 kB) BC846BMB_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BC846BMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC846BMB_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- BC846BMB SPICE model (REV 1.4) prm BC846BMB_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | VCEO [max] (V) | Configuration | IC max (mA) | hFE [min] | hFE max | hFE [max] | fT [min] (MHz) | Polarity | fr [min] (MHz) | Complement | IC [max] (mA) | Ptot [max] (mW) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC846BMB | Active | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | 250 | 65 | 1 | 200 | 450 | NPN | 100 | 100 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC846BMB | | SOT883B | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BC846BMB,315 (9340 661 34315) | 0100 1011 | BC846BMB |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BC846BMB NXP Product Quality BC846BMB
- BC846BMB NXP® Product Reliability BC846BMB
- BC846BMB SPICE model BC846BMB
- DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
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