BC857BMB: 45 V, 100 mA PNP general-purpose transistors
PNP general-purpose transistors in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package.
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Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 45 V, 100 mA PNP general-purpose transistors (REV 1.0) PDF (373.0 kB) BC857XMB_SER | 22 Feb 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 | 22 Jul 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BC857BMB NXP Product Quality (REV 1.2) PDF (74.0 kB) BC857BMB_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BC857BMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC857BMB_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- BC857BMB SPICE model (REV 1.4) prm BC857BMB 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Complement | Ptot (mW) | Configuration | IC [max] (mA) | Polarity | IC max (mA) | Ptot [max] (mW) | VCEO [max] (V) | hFE max | fT [min] (MHz) | hFE [max] | fr [min] (MHz) | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC857BMB | Active | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | 250 | 1 | -100 | PNP | -45 | 475 | 100 | 220 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC857BMB | | SOT883B | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BC857BMB,315 (9340 658 89315) | 0100 0101 | BC857BMB |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BC857BMB NXP Product Quality BC857BMB
- BC857BMB NXP® Product Reliability BC857BMB
- BC857BMB SPICE model BC857XMB_SERIES
- DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
- PMZB950UPE
