BC859BW: PNP general purpose transistors
PNP transistor in a SOT323 plastic package.
NPN complements: BC849W and BC850W.
SOT323
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| PNP general purpose transistors (REV 4.0) PDF (123.0 kB) BC859W_860W | 12 Apr 1999 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 | 16 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT323_135 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BC859BW NXP Product Quality (REV 1.2) PDF (74.0 kB) BC859BW_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BC859BW NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC859BW_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE model
- BC859BW SPICE model (REV 1.4) prm BC859BW 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | hFE min | Ptot (mW) | hFE max | Configuration | VCEO [max] (V) | fT min (MHz) | Complement | hFE [min] | IC [max] (mA) | IC max (mA) | hFE [max] | VCEO max (V) | Ptot max (mW) | fT [min] (MHz) | fr [min] (MHz) | Polarity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC859BW | Active | SOT323 | SC-70 | 2 x 1.25 x 0.95 | 220 | 200 | 475 | 1 | -30 | 100 | BC849BW | 220 | -100 | 100 | 475 | 30 | 200 | PNP |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC859BW | | SOT323 | Reflow_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BC859BW,135 (9340 243 10135) | 4B% | BC859BW |    | week 30, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BC859BW,115 (9340 243 10115) | 4B% | BC859BW | | week 30, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- PNP general purpose transistors BC860CW
- BC859BW NXP Product Quality BC859BW
- BC859BW NXP® Product Reliability BC859BW
- Letter Symbols - Transistors; General PEMD16
- BC859BW SPICE model BC859W_BC860W
- plastic surface-mounted package; 3 leads BSS84AKW
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BAT854CW
- Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKW
- PRF947
