BCP56-10: 80 V, 1 A NPN medium power transistor
NPN medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. PNP complement: BCP53.
SOT223
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 80 V, 1 A NPN medium power transistors (REV 9.0) PDF (1.1 MB) BCP56_BCX56_BC56PA | 07 Nov 2011 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 | 06 Jan 2006 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 | 26 May 2015 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BCP56-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP56-10_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BCP56-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP56-10_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE model
- BCP56-10 SPICE model (REV 1.4) prm BCP56-10 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Complement | Ptot (mW) | IC [max] (mA) | Polarity | IC max (mA) | Ptot [max] (mW) | VCEO [max] (V) | hFE max | fT [min] (MHz) | hFE [max] | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP56-10 | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | BCP53-10 | 1000 | NPN | 1350 | 80 | 180 | 160 | 63 | |||
| BCP56-10/R | No Longer Manufactured | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | |||||||||||
| BCP56-10/A | No Longer Manufactured | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP56-10 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP56-10,135 (9339 172 50135) | BCP56/10 | BCP56-10 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP56-10,115 (9339 172 50115) | BCP56/10 | BCP56-10 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
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- BCP56-10 NXP Product Quality BCP56-10
- BCP56-10 NXP® Product Reliability BCP56-10
- Letter Symbols - Transistors; General PEMD16
- BCP56-10 SPICE model BCP56-10
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BLT81
