BCV27; BCV47: NPN Darlington transistors
NPN Darlington transistor in a SOT23 plastic package. PNP complements: BCV26 and BCV46.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| NPN Darlington transistors (REV 5.0) PDF (116.0 kB) BCV27_BCV47 [English] | 13 Jan 2004 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
Packing (3)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 185 (REV 1.0) PDF (214.0 kB) SOT23_185 [English] | 16 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
Reliability and Quality Information (4)
| Name/Description | Modified Date |
|---|---|
| BCV27 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCV27_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCV27 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCV27_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCV47 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCV47_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCV47 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCV47_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE model
- BCV27 SPICE model (REV 1.4) prm BCV27 7/22/2012
- BCV47 SPICE model (REV 1.4) prm BCV47 7/22/2012
Ordering Information
| Product | Status |
|---|---|
| BCV27 | Active |
| BCV47 | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCV47 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BCV47,215 (9339 323 20215) | FG% | BCV47 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11" Q3/T4, LargePack | Active | BCV47,235 (9339 323 20235) | FG% | BCV47 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCV27 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BCV27,215 (9338 062 20215) | FF% | BCV27 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Tape reel SMD; standard product orientation 12NC ending 185 BAT54S
- BCV27 NXP Product Quality BCV27
- BCV27 NXP® Product Reliability BCV27
- BCV47 NXP Product Quality BCV47
- BCV47 NXP® Product Reliability BCV47
- Letter Symbols - Transistors; General PEMD16
- BCV27 SPICE model BCV27_BCV47
- BCV47 SPICE model BCV47
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
