BCV61: NPN general-purpose double transistors
NPN general-purpose double transistors in a small SOT143B Surface-Mounted Device (SMD) plastic package.
Outline 3d SOT143b
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| NPN general-purpose double transistors (REV 4.0) PDF (139.0 kB) BCV61 [English] | 21 Jan 2010 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 4 leads (REV 1.0) PDF (225.0 kB) SOT143B [English] | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (187.0 kB) SOT143B_215 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 1.0) PDF (187.0 kB) SOT143B_235 [English] | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BCV61 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCV61_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCV61 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCV61_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- BCV61 SPICE model (REV 1.4) prm BCV61_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Description |
|---|---|---|---|---|---|
| BCV61 | Active | SOT143B | SOT143B | 2.9 x 1.3 x 1 | Current Mirror |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCV61 | | SOT143B | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BCV61,235 (9336 772 20235) | 1M% | BCV61 |    | week 49, 2002 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BCV61,215 (9336 772 20215) | 1M% | BCV61 | | week 49, 2002 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BCV61 NXP Product Quality BCV61
- BCV61 NXP® Product Reliability BCV61
- BCV61 SPICE model BCV61
- plastic surface-mounted package; 4 leads prtr5v0u2x
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 prtr5v0u2ax
- Tape reel SMD; standard product orientation 12NC ending 215 prtr5v0u2x
- BF996S
