PNP transistor in a SOT23 plastic package.
NPN complement: BCW60.
Name/Description | Modified Date |
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PNP general purpose transistors (REV 3.0) PDF (121.0 kB) BCW61 | 12 Apr 1999 |
Name/Description | Modified Date |
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plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Name/Description | Modified Date |
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Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Name/Description | Modified Date |
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BCW61B NXP Product Quality (REV 1.2) PDF (74.0 kB) BCW61B_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
BCW61B NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCW61B_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Complement | Configuration | IC [max] (mA) | Polarity | IC max (mA) | Ptot [max] (mW) | VCEO [max] (V) | hFE max | fT [min] (MHz) | hFE [max] | fr [min] (MHz) | hFE [min] |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BCW61B | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 250 | 1 | -100 | PNP | -32 | 310 | 180 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BCW61B | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BCW61B,215 (9333 241 30215) | BB% | BCW61B | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |