BF824: PNP medium frequency transistor
PNP medium frequency transistor in a SOT23 plastic package.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| PNP medium frequency transistor (REV 4.0) PDF (98.0 kB) BF824 | 16 Jan 2004 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BF824 NXP Product Quality (REV 1.2) PDF (74.0 kB) BF824_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BF824 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BF824_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE model
- BF824 SPICE model (REV 1.4) prm BF824_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | hFE min | Ptot (mW) | Configuration | VCEO [max] (V) | hFE max | fT min (MHz) | Ptot max (mW) | hFE [min] | IC max (mA) | IC [max] (mA) | VCEO max (V) | hFE [max] | Polarity | fT [min] (MHz) | fr [min] (MHz) | Complement |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BF824 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 25 | 250 | 1 | -30 | >50 | 450 | 250 | 25 | 25 | -25 | 30 | 50 | PNP |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BF824 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BF824,235 (9337 223 50235) | F8% | BF824 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BF824,215 (9337 223 50215) | F8% | BF824 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BF824 NXP Product Quality bf824
- BF824 NXP® Product Reliability bf824
- Letter Symbols - Transistors; General PEMD16
- BF824 SPICE model BF824
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
