数据手册DataSheet 下载BLM7G1822S-80ABG LDMOS 2-stage power MMIC.pdf

The BLM7G1822S-80AB(G) is a dual section, asymmetric, 2-stage power MMIC using NXP’s state of the art GEN7 LDMOS technology. This multiband device is perfectly suited for small cell final in Doherty configuration, or as general purpose driver in the frequency range from 1805 MHz to 2170 MHz. Available in gull wing or straight lead outline.

产品特点
  • Designed for broadband operation (frequency 1805 MHz to 2170 MHz)
  • High section-to-section isolation enabling multiple combinations
  • High Doherty efficiency thanks to 2 : 1 asymmetry
  • Integrated temperature compensated bias
  • Biasing of individual stages is externally accessible
  • Integrated ESD protection
  • Excellent thermal stability
  • High power gain
  • On-chip matching for ease of use
  • Compliant to Directive 2002/95/EC, regarding restriction of hazardous substances (RoHS)
产品应用
  • RF power MMIC for W-CDMA base stations in the 1805 MHz to 2170 MHz frequency range. Possible circuit topologies are the following:
    • Asymmetric final stage in Doherty configuration
    • Asymmetric driver for high power Doherty amplifier
订购型号
订购型号封装Outline versionReflow-/Wave soldering包装产品状态标示订购器件的编号
BLM7G1822S-80ABGHSOP16 (SOT1212-1)sot1212-1_poReel Dry Pack, SMD, 13" Q1/T1开发Standard MarkingBLM7G1822S-80ABGY( 9340 687 27518 )
品质、可靠性及RoHS化学成分
订购型号订购器件的编号RoHS / RHF无铅开始日期EFRIFR (FIT)MTBF(小时)潮湿敏感度等级MSL LF
BLM7G1822S-80ABGBLM7G1822S-80ABGY3
产品技术资料
文档标题类型分类格式更新日期
AN11183:Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
75017347:Enabling the Mobile ExperienceBrochurepdf2013-02-05
fatigue_in_aluminum_bond_wires:Fatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
75017565:NXP's RF Manual 18th editionSelection guidepdf2014-06-17
sot1212-1_po:plastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2012-04-17
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Enabling the Mobile Experience rf
Fatigue in aluminum bond wires gan_devices
NXP's RF Manual 18th edition OL2300NHN
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45ABG