数据手册DataSheet 下载:BLM7G22S-60PBG LDMOS 2级功率MMIC.pdf
BLM7G22S-60PB(G) 是一款双路径2级MMIC,使用恩智浦先进的GEN7 LDMOS技术。此器件完美适合用作2100 MHz至2200 MHz频率范围内的通用驱动器。提供鸥翼或扁平引脚外形。
产品特点
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订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
BLM7G22S-60PBG | HSOP16 (SOT1212-1) | sot1212-1_po | Reel Dry Pack, SMD, 13" Q1/T1 | 激活 | Standard Marking | BLM7G22S-60PBGY( 9340 660 83518 ) | |
BLM7G22S-60PBG | HSOP16 (SOT1212-1) | sot1212-1_po | Reel Pack, SMD, 13" Q1/T1 | 撤回替代产品 | Standard Marking | BLM7G22S-60PBG,118( 9340 660 83118 ) |
订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF(小时) | 潮湿敏感度等级 | MSL LF |
BLM7G22S-60PBG | BLM7G22S-60PBGY | 3 | 3 | |||||
BLM7G22S-60PBG | BLM7G22S-60PBG,118 | 3 | 3 |
文档标题 | 类型分类 | 格式 | 更新日期 |
BLM7G22S-60PB_7G22S-60PBG (中文):LDMOS 2-stage power MMIC | Data sheet | 2012-12-11 | |
AN11183:Mounting and soldering of RF transistors in over-molded plastic packages | Application note | 2012-11-06 | |
75017347:Enabling the Mobile Experience | Brochure | 2013-02-05 | |
PCB_Design_BLM7G22S-60PB_7G22S-60PBG_Data-sheet:PCB Design BLM7G22S-60PB(G) (Data sheet) | Design support | zip | 2012-12-13 |
fatigue_in_aluminum_bond_wires:Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
75017565:NXP's RF Manual 18th edition | Selection guide | 2014-06-17 | |
BLM7G22S-60PBG_ADS-2009_Model:BLM7G22S-60PBG ADS-2009 Model | Simulation model | zip | 2013-08-01 |
sot1212-1_po:plastic, heatsink small outline package; 16 leads(flat) | Outline drawing | 2012-04-17 |