BSP52: NPN Darlington transistors
NPN Darlington transistor in a SOT223 plastic package.
PNP complements: BSP60, BSP61 and BSP62.
SOT223
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| NPN Darlington transistors (REV 3.0) PDF (120.0 kB) BSP50_51_52 | 23 Apr 1999 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BSP52 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP52_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BSP52 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP52_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE model
- BSP52 SPICE model (REV 1.4) prm BSP52 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | hFE min | Ptot (mW) | Configuration | VCEO [max] (V) | hFE max | fT min (MHz) | Polarity | hFE [min] | IC [max] (mA) | Complement | IC max (mA) | hFE [max] | fT [min] (MHz) | VCES max (V) | Ptot max (mW) | fr [min] (MHz) | toff (ns) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP52 | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | 2000 | 1250 | 1 | 80 | >2000 | 200 | NPN | 2000 | 1000 | BSP62 | 1000 | 80 | 1250 | 1300 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP52 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP52,115 (9339 694 70115) | BSP52 | BSP52 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BSP52 NXP Product Quality BSP52
- BSP52 NXP® Product Reliability BSP52
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BSP52 SPICE model BSP52
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BLT81
