BSP62: PNP Darlington transistors
PNP Darlington transistor in a SOT223 plastic package. NPN complements: BSP50, BSP51 and BSP52.
BSP62: Product Block Diagram
SOT223
Industrial switching applications such as:
-Print hammer
-Solenoid
-Relay and lamp drivers.
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| PNP Darlington transistors (REV 5.0) PDF (120.0 kB) BSP60_61_62 | 31 May 2001 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BSP62 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP62_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BSP62 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP62_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE model
- BSP62 SPICE model (REV 1.4) prm BSP62 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Complement | VCEO [max] (V) | IC [max] (mA) | Configuration | IC max (mA) | Polarity | Ptot [max] (mW) | toff (ns) | hFE max | fT [min] (MHz) | hFE [max] | fr [min] (MHz) | hFE [min] | VCES [max] (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP62 | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | 1250 | -80 | -1000 | 1 | PNP | 1250 | 1500 | 200 | >2000 | 2000 | 80 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP62 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP62,115 (9339 694 80115) | BSP62 | BSP62 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BSP62 NXP Product Quality BSP62
- BSP62 NXP® Product Reliability BSP62
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BSP62 SPICE model BSP62
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BSP60_BSP61_BSP62
- BLT81
