BSS192: 240 V, P-channel vertical D-MOS transistor
P-channel enhancement mode vertical Double-Diffused Field-Effect Transistor (D-MOSFET) in a SOT89 (SC-62) medium power and flat lead Surface Mounted Device (SMD) plastic package.
BSS192: Product Block Diagram
SOT089
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 240 V, P-channel vertical D-MOS transistor (REV 4.0) PDF (256.0 kB) BSS192 [English] | 12 Dec 2014 |
Application Notes (10)
| Name/Description | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
| Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English] | 10 Dec 2015 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English] | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
| Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158 [English] | 04 Feb 2014 |
| Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH [English] | 08 Nov 2013 |
| Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243 [English] | 29 Oct 2012 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English] | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
Selector Guides (3)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English] | 11 Sep 2014 |
| Broad small-signal MOSFET portfolio to suit a wide range of applications (REV 1.0) PDF (3.3 MB) 75017288 [English] | 23 Aug 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English] | 28 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BSS192 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSS192_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSS192 NXP® Product Reliability (REV 1.1) PDF (84.0 kB) BSS192_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 [English] | 31 Oct 2016 |
SPICE model
- BSS192 Spice model (REV 1.0) lib BSS192_10_05_2012 12/13/2013
- BSS192 SPICE model (REV 1.3) prm BSS192_1 6/8/2012
Ordering Information
| Product | Status | Package name | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSS192 | Not Recommended for New Design | SOT89 | PP | 1 | -240 | 12000 | 18000 | 150 | -0.34 | 0.6 | 1.9 | 1.9 | 0.56 | NN | 55 | 20 | 2011-01-24 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSS192 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BSS192,135 (9339 439 50135) | KB | BSS192 |    | week 28, 2003 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BSS192,115 (9339 439 50115) | KB | BSS192 | | week 28, 2003 | 1 | 1 |
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7M12-60E
- Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7K6R8-40E
- Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
- BSS192 NXP Product Quality BSS192
- BSS192 SPICE model BSS192
- BSS192 Spice model BSS192
- Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- SOT89 Reel pack, SMD, 7" T4 Turned 90 degree product orientation Ordering code (12NC) ending 147 BCX56-16
- Reel pack, SMD, 7" T3 Turned 270 degree product orientation Ordering code (12NC) ending 146 BCX53-16
- Footprint for reflow soldering SOT089 BFU590Q
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BFU590Q
- Footprint for wave soldering SOT089 BFU590Q
