IP4233CZ6: Ultra low capacitance ESD protection for Ethernet ports
The IP4233CZ6 is designed to protect Input/Output (I/O) ports that are sensitive to capacitive loads, such as Ethernet, from destruction by ElectroStatic Discharge (ESD).
The IP4233CZ6 incorporates two pairs of ultra low capacitance back-to-back diodes which protect components from ESD voltages as high as ±8 kV contact discharge according to IEC 61000-4-2, level 4.
The back-to-back diodes prevent negative clipping of AC signals and voltages below zero.
The IP4233CZ6 is fabricated using monolithic silicon technology integrating two ultra low capacitance back-to-back ESD protection diodes in a very small 6-lead SOT363 package.
SOT363
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Ultra low capacitance ESD protection for Ethernet ports (REV 3.0) PDF (206.0 kB) IP4233CZ6 [English] | 24 Jun 2010 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English] | 20 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| IP4233CZ6 NXP® Product Reliability (REV 1.0) PDF (88.0 kB) IP4233CZ6_1 [English] | 16 Jul 2014 |
| IP4233CZ6 NXP® Product Quality (REV 1.0) PDF (16.0 kB) IP4233CZ6_NXP_PRODUCT_QUALITY [English] | 22 Apr 2014 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Application | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IP4233CZ6 | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IP4233CZ6 | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | IP4233CZ6,125 (9340 626 14125) | Standard Marking | IP4233CZ6 |    | Always Pb-free | 139.0 | 0.64 | 1.56E9 | 1 |
- IP4233CZ6 NXP® Product Reliability IP4233CZ6
- IP4233CZ6 NXP® Product Quality IP4233CZ6
- MAR_SOT363 Topmark BSS84AKS
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- BFU520Y
