NX1029X: 60 / 50 V, 330 / 170 mA N/P-channel Trench MOSFET _ BDTIC a Leading Distributor in China

NX1029X: 60 / 50 V, 330 / 170 mA N/P-channel Trench MOSFET

Complementary N/P-channel enhancement mode Field-Effect Transistor (FET) in an ultra small and flat lead SOT666 Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

SOT666

Data Sheets (1)

Name/Description	Modified Date
60 / 50 V, 330 / 170 mA N/P-channel Trench MOSFET (REV 1.0) PDF (950.0 kB) NX1029X	12 Aug 2011

Application Notes (10)

Name/Description	Modified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599	13 Jul 2016
Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273	10 Dec 2015
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH	22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261	19 May 2014
Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158	04 Feb 2014
Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH	08 Nov 2013
Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243	29 Oct 2012
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH	14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113	16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874	27 Jan 2011

Selector Guides (3)

Name/Description	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631	17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590	11 Sep 2014
Broad small-signal MOSFET portfolio to suit a wide range of applications (REV 1.0) PDF (3.3 MB) 75017288	23 Aug 2012

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666	08 Feb 2016

Packing (1)

Name/Description	Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115	29 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
NX1029X NXP Product Quality (REV 1.2) PDF (74.0 kB) NX1029X_NXP_PRODUCT_QUALITY	31 Jan 2015
NX1029X NXP® Product Reliability (REV 1.1) PDF (84.0 kB) NX1029X_NXP_PRODUCT_RELIABILITY	31 Jan 2015

Supporting Information (2)

Name/Description	Modified Date
Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008	31 Oct 2016
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013

SPICE model

NX1029X_N_Tr1_8_18_2010 Spice parameter (REV 1.0) lib NX1029X_N_TR1_8_18_2010 8/22/2011
NX1029X_P_Tr2_4_7_2011 Spice parameter (REV 1.0) lib NX1029X_P_TR2_4_7_2011 8/22/2011

Ordering Information

Product	Status	Package version	Package name	Channel type	Number of transistors	V_DS [max] (V)	R_DSon [max] @ V_GS = 10 V (mΩ)	R_DSon [max] @ V_GS = 5 V (mΩ)	R_DSon [max] @ V_GS = 4.5 V (mΩ)	R_DSon [max] @ V_GS = 2.5 V (mΩ)	I_D [max] (A)	T_j [max] (°C)	R_DSon [typ] @ V_GS = 10 V (mΩ)	Q_GD [typ] (nC)	R_DSon [typ] @ V_GS = 5 V (mΩ)	QG(tot) [typ] @ VGS = 4.5 V (nC)	Q_G(tot) [typ] (nC)	P_tot [max] (W)	QG(tot) [typ] @ VGS = 10 V (nC)	Q_r [typ] (nC)	V_GSth [typ] (V)	I_D [max] @ T = 100 °C (A)	Automotive qualified	C_iss [typ] (pF)	I_DM [max] (A)	C_oss [typ] (pF)	Date	R_th(j-mb) [max] (K/W)
NX1029X	Active	SOT666	SOT666	N/P	2	60	1600	2000			0.33	150	1000	0.1	1300	0.5	0.5	0.33			1.6	0.21	Y	33	1.2	7	2011-08-12	33

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
NX1029X		SOT666	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	NX1029X,115 (9340 656 43115)	AD	NX1029X		Always Pb-free	149.0	0.69	1.45E9	1	1

60 / 50 V, 330 / 170 mA N/P-channel Trench MOSFET nx1029x

Using power MOSFETs in parallel BUK7M12-60E

Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E

LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E

Using RC Thermal Models BUK7M12-60E

Understanding power MOSFET data sheet parameters BUK7M12-60E

Understanding power MOSFET data sheet parameters BUK7K6R8-40E

Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E

LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E

LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E

LFPAK MOSFET thermal design guide BUK7M12-60E

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW

Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW

NX1029X NXP Product Quality nx1029x

NX1029X NXP® Product Reliability nx1029x

Power MOSFET frequently asked questions and answers BUK7M12-60E

NX1029X_N_Tr1_8_18_2010 Spice parameter NX1029X

NX1029X_P_Tr2_4_7_2011 Spice parameter NX1029X

plastic surface-mounted package; 6 leads BSS84AKV

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKV

1PSXSB17

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