NX2020P1: 30 V, single P-channel Trench MOSFET
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
sot1220_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 30 V, single P-channel Trench MOSFET (REV 2.0) PDF (267.0 kB) NX2020P1 [English] | 26 Feb 2014 |
Application Notes (6)
| Name/Description | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English] | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English] | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
Selector Guides (2)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English] | 11 Sep 2014 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals (REV 1.0) PDF (212.0 kB) SOT1220 [English] | 08 Feb 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| NX2020P1 NXP Product Quality (REV 1.2) PDF (74.0 kB) NX2020P1_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| NX2020P1 NXP® Product Reliability (REV 1.1) PDF (84.0 kB) NX2020P1_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 [English] | 31 Oct 2016 |
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
- 30 V, single P-channel Trench MOSFET NX2020P1
- LFPAK MOSFET thermal design guide BUK7M12-60E
- LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- Using RC Thermal Models BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
- Using power MOSFETs in parallel BUK7M12-60E
- NX2020P1 NXP Product Quality NX2020P1
- NX2020P1 NXP Product Reliability NX2020P1
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
- plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals PMPB95ENEA
- Footprint for reflow soldering SOT1220 PMPB95ENEA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
