NX3DV221TK: High-speed USB 2.0 switch with enable

The NX3DV221 is a high-bandwidth switch designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1 GHz) of this switch allows signal to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

sot650-2_3d
Data Sheets (1)
Name/DescriptionModified Date
High-speed USB 2.0 switch with enable (REV 4.0) PDF (1.1 MB) NX3DV22119 Jun 2013
Brochures (1)
Name/DescriptionModified Date
NXP® analog switches NX3 and NX5 families (REV 1.0) PDF (1.5 MB) 7501737304 Mar 2013
Package Information (1)
Name/DescriptionModified Date
plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm (REV 1.0) PDF (174.0 kB) SOT650-208 Feb 2016
Ordering Information
ProductStatusFamilyFunctionConfigurationDescriptionVCC (V)Logic switching levelsPackage versionRON (Ohm)RON(FLAT) (Ohm)f(-3dB) (MHz)THD (%)Xtalk (dB)Power dissipation considerationsTamb (Cel)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package nameNo of pins
NX3DV221TKActiveNX3USB2.0 switch with enableDPDT-ZAnalog switches2.3 - 3.6CMOS/LVTTLSOT650-270.71000-40low-40~85HVSON1010
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
NX3DV221TKSOT650-2Reel 7" Q1/T1ActiveNX3DV221TKX (9353 009 55115)x21NX3DV221TKAlways Pb-free11
High-speed USB 2.0 switch with enable NX3DV221TK
NXP® analog switches NX3 and NX5 families NX3L4051_Q100
plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm BGU8063
BGU8062