NXP3875Y: 50 V, 150 mA NPN general-purpose transistors
NPN general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 50 V, 150 mA NPN general-purpose transistors (REV 1.1) PDF (1.0 MB) NXP3875Y_NXP3875G | 12 Dec 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| NXP3875Y NXP Product Quality (REV 1.2) PDF (74.0 kB) NXP3875Y_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| NXP®3875Y NXP Product Reliability (REV 1.1) PDF (82.0 kB) NXP3875Y_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- NXP3875Y SPICE model (REV 1.0) prm NXP3875Y 3/22/2013
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | VCEO [max] (V) | Configuration | IC max (mA) | hFE [min] | IC [max] (mA) | hFE max | hFE [max] | fT [min] (MHz) | fr [min] (MHz) | Polarity | Complement |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP3875Y | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 200 | 50 | 1 | 120 | 150 | 240 | 80 | NPN |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP3875Y | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | NXP3875YR (9340 672 38215) | %JE | NXP3875Y |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11" Q3/T4, LargePack | Active | NXP3875YVL (9340 672 38235) | %JE | NXP3875Y | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- NXP3875Y NXP Product Quality NXP3875Y
- NXP®3875Y NXP Product Reliability NXP3875Y
- NXP3875Y SPICE model NXP3875Y_NXP3875G
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- PMBFJ309
