PBHV9050Z: 500 V, 250 mA PNP high-voltage low VCEsat (BISS) transistor
PNP high-voltage low VCEsat Breakthrough In Small Signal (BISS) transistor in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.
SOT223
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 500 V, 250 mA PNP high-voltage low V_CEsat (BISS) transistor (REV 1.0) PDF (333.0 kB) PBHV9050Z | 23 Aug 2010 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBHV9050Z NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBHV9050Z_1 | 31 Jan 2015 |
| PBHV9050Z NXP Product Quality (REV 1.2) PDF (74.0 kB) PBHV9050Z_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PBHV9050Z SPICE model (REV 1.4) prm PBHV9050Z_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | transistor polarity | Transistor polarity | Ptot [max] (mW) | Polarity | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBHV9050Z/ZL | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 700 | -500 | -0.25 | -0.5 | 100 | 160 | 50 | -200 | |||
| PBHV9050Z | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 700 | PNP | -500 | -0.25 | -0.5 | 100 | 160 | 50 | -200 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBHV9050Z | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PBHV9050Z,115 (9340 645 53115) | V9050Z |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| PBHV9050Z/ZL | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | PBHV9050Z/ZLF (9340 707 65135) | Standard Marking | PBHV9050Z/ZL | 153.0 | 0.71 | 1.41E9 | ||||
| Reel 7" Q1/T1 | Active | PBHV9050Z/ZLX (9340 707 65115) | Standard Marking | PBHV9050Z/ZL | 153.0 | 0.71 | 1.41E9 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBHV9050Z NXP® Product Reliability PBHV9050Z
- PBHV9050Z NXP Product Quality PBHV9050Z
- PBHV9050Z SPICE model PBHV9050Z
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BLT81
