PBRN123ET: NPN 800 mA, 40 V BISS RETs; R1 = 2.2 kOhm, R2 = 2.2 kOhm _ BDTIC a Leading Distributor in China

PBRN123ET: NPN 800 mA, 40 V BISS RETs; R1 = 2.2 kOhm, R2 = 2.2 kOhm

800 mA NPN low VCEsat Breakthrough In Small Signal (BISS) Resistor-Equipped Transistors (RET) family in small plastic packages.

SOT023

Data Sheets (1)

Name/Description	Modified Date
NPN 800 mA, 40 V BISS RETs; R1 = 2.2 kOhm, R2 = 2.2 kOhm (REV 1.0) PDF (153.0 kB) PBRN123E_SER	27 Feb 2007

Brochures (2)

Name/Description	Modified Date
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543	01 Jun 2008
500 mA RETs for Automotive applications; NXP® 500 mA resistor-equipped transistors (RETs) PDTD and PDTB... (REV 1.0) PDF (1.1 MB) 75016559	01 Jun 2008

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23	08 Feb 2016

Packing (1)

Name/Description	Modified Date
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215	16 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
PBRN123ET NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBRN123ET	31 Jan 2015
PBRN123ET NXP Product Quality (REV 1.2) PDF (74.0 kB) PBRN123ET_NXP_PRODUCT_QUALITY	31 Jan 2015

Supporting Information (2)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013

Design Support

Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999

SPICE model

PBRN123ET SPICE model (REV 1.4) prm PBRN123ET_1 7/22/2012

Ordering Information

Product	Status	Package version	Package name	Size (mm)	channel type	P_tot (mW)	R2 (typ) (kΩ)	I_C [max] (mA)	R1 (typ) (kΩ)	V_CEO (V)
PBRN123ET	Active	SOT23	TO-236AB	2.9 x 1.3 x 1	NPN	250	2.2	800	2.2	40

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
PBRN123ET		SOT23	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4	Active	PBRN123ET,215 (9340 589 92215)	%7J	PBRN123ET		Always Pb-free	153.0	0.71	1.41E9	1	1

NPN 800 mA, 40 V BISS RETs; R1 = 2.2 kOhm, R2 = 2.2 kOhm PBRN123ET

Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... PMEG6010CE_AUTOMOTIVE

500 mA RETs for Automotive applications; NXP® 500 mA resistor-equipped transistors (RETs) PDTD and PDTB... PIMN31

Letter Symbols - Transistors; General PEMD16

PBRN123ET NXP Product Quality PBRN123ET

PBRN123ET NXP® Product Reliability PBRN123ET

plastic surface-mounted package; 3 leads PMBFJ309

Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Footprint for reflow soldering SOT023 PMBFJ309

Footprint for wave soldering SOT023 PMBFJ309

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

PBRN123ET SPICE model PBRN123ET

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