PBSM5240PF: 40 V, 2 A PNP low VCEsat (BISS) transistor with N-channel Trench MOSFET
Combination of PNP low VCEsat Breakthrough In Small Signal (BISS) transistor and N-channel Trench MOSFET. The device is housed in a leadless medium power SOT1118 Surface-Mounted Device (SMD) plastic package.
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Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 40 V, 2 A PNP low VCEsat (BISS) transistor with N-channel Trench MOSFET (REV 2.0) PDF (795.0 kB) PBSM5240PF [English] | 22 Apr 2011 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Protecting charger interfaces and typical battery charging topologies with external bypass transistors (REV 2.0) PDF (204.0 kB) AN10910 [English] | 01 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (198.0 kB) SOT1118 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-6; reel pack; standard orientation; 12NC ending 115 (REV 1.0) PDF (196.0 kB) SOT1118_115 [English] | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSM5240PF NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSM5240PF_1 [English] | 31 Jan 2015 |
| PBSM5240PF NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSM5240PF_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PBSM5240PF_NMOS SPICE model (REV 1.4) prm PBSM5240PF_NMOS 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | transistor polarity | Transistor polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | RCEsat [typ] (mΩ) | RCEsat [max] (mΩ) | VCEsat [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSM5240PF | Active | SOT1118 | DFN2020-6 | 2 x 2 x 0.65 | PNP | 1250 | 1 | -40 | -1.8 | -3 | 300 | 150 | 240 | 340 | -310 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSM5240PF | | SOT1118 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PBSM5240PF,115 (9340 651 27115) | 1G | PBSM5240PF |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Protecting charger interfaces and typical battery charging topologies with external bypass transistors prtr5v0u2f
- PBSM5240PF NXP® Product Reliability PBSM5240PF
- PBSM5240PF NXP Product Quality PBSM5240PF
- PBSM5240PF_NMOS SPICE model PBSM5240PF
- DFN2020-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm PBSS5260PAP
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-6; reel pack; standard orientation; 12NC ending 115 PBSS5260PAP
- PMFPB8040XP
