PBSS302NX: 20 V, 5.3 A NPN low VCEsat (BISS) transistor
NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT89 (SC-62/TO-243) small and flat lead Surface-Mounted Device (SMD) plastic package.
PNP complement: PBSS302PX.
PBSS302NX: Product Block Diagram
SOT089
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 20 V, 5.3 A NPN low VCEsat (BISS) transistor (REV 2.0) PDF (189.0 kB) PBSS302NX | 08 Dec 2009 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 | 28 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS302NX NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS302NX_1 | 31 Jan 2015 |
| PBSS302NX NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS302NX_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
SPICE model
- PBSS302NX SPICE model (REV 1.4) prm PBSS302NX_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Transistor polarity | transistor polarity | number of transistors | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS302NX | Active | SOT89 | SOT89 | 4.5 x 2.5 x 1.5 | NPN | 1 | 600 | 20 | 5.3 | 10.6 | 300 | 570 | 140 | 0.0280.035 | 220 | 40 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS302NX | | SOT89 | Reel 7" Q1/T1 | Active | PBSS302NX,115 (9340 590 08115) | %5C | PBSS302NX |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS302NX NXP® Product Reliability PBSS302NX
- PBSS302NX NXP Product Quality PBSS302NX
- PBSS302NX SPICE model PBSS302NX
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- PBSS8110X
- BFU590Q
