PBSS3540M: 40 V, 0.5 A PNP low VCEsat (BISS) transistor
Low VCEsat PNP transistor in a SOT883 leadless ultra small plastic package. NPN complement: PBSS2540M.
SOT883
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 40 V, 0.5 A PNP low VCEsat (BISS) transistor (REV 1.0) PDF (291.0 kB) PBSS3540M | 12 Aug 2003 |
Application Notes (2)
| Name/Description | Modified Date |
|---|---|
| Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 | 04 Mar 2013 |
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 | 22 Jul 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS3540M NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS3540M_1 | 31 Jan 2015 |
| PBSS3540M NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS3540M_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PBSS3540M SPICE model (REV 1.4) prm PBSS3540M_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | transistor polarity | Transistor polarity | number of transistors | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | fT [min] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS3540M | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | PNP | 1 | 250 | -40 | -0.5 | -1 | 200 | 300 | 100 | 440 | -50 | 700 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS3540M | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PBSS3540M,315 (9340 571 55315) | DA | PBSS3540M |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS3540M NXP® Product Reliability PBSS3540M
- PBSS3540M NXP Product Quality PBSS3540M
- PBSS3540M SPICE model PBSS3540M
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- PMZ950UPE
