NPN low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and soldarable side pads.
PNP complement: PBSS5330PAS
Name/Description | Modified Date |
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30 V, 3 A NPN low VCEsat (BISS) transistor (REV 1.0) PDF (248.0 kB) PBSS4330PAS [English] | 11 Sep 2014 |
Name/Description | Modified Date |
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DFN2020D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (192.0 kB) SOT1061D [English] | 08 Feb 2016 |
Name/Description | Modified Date |
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PBSS4330PAS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS4330PAS_1 [English] | 31 Jan 2015 |
PBSS4330PAS NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4330PAS_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Product | Status | Package version | Package name | Size (mm) | transistor polarity | Transistor polarity | number of transistors | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | RCEsat [typ] (mΩ) | RCEsat [max] (mΩ) | VCEsat [max] (mV) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PBSS4330PAS | Active | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | NPN | 1 | 2500 | 30 | 3 | 5 | 300 | 465 | 100 | 210 | 75 | 100 | 300 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PBSS4330PAS | SOT1061D | Reel 7" Q1/T1 | Active | PBSS4330PASX (9340 681 06115) | E1 | PBSS4330PAS | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |