PBSS5160DS: 60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor pair in a small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package.
NPN complement: PBSS4160DS.
PBSS5160DS: Product Block Diagram
PBSS5160DS: Block Diagram
SOT457
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 60 V, 1 A PNP/PNP low VCEsat (BISS) transistor (REV 3.0) PDF (141.0 kB) PBSS5160DS | 09 Oct 2008 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 | 30 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS5160DS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5160DS_1 | 31 Jan 2015 |
| PBSS5160DS NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5160DS_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 | 03 Jun 2013 |
SPICE model
- PBSS5160DS SPICE model (REV 1.4) prm PBSS5160DS_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Transistor polarity | transistor polarity | number of transistors | Polarity | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | VCEsat [max] (PNP) (mV) | RCEsat@IC [max]; IC/IB =10 [typ] (mΩ) | fT [min] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5160DS | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | PNP | 2 | PNP | 420 | -60 | -0.77 | -2 | 200 | 350 | 185 | -330 | 330.00000000000002 | 150 | 250 | -165 | 330 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5160DS | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PBSS5160DS,115 (9340 581 21115) | A5 | PBSS5160DS |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS5160DS NXP® Product Reliability pbss5160ds
- PBSS5160DS NXP Product Quality pbss5160ds
- MAR_SOT457 Topmark 74LVC2G17_Q100
- PBSS5160DS SPICE model PBSS5160DS
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- PESDXS5UD_SERIES
- PBSS5160DS
- SSL5021_SSL5031
