PBSS5350D: 50 V, 3 A PNP low VCEsat (BISS) transistor _ BDTIC a Leading Distributor in China

PBSS5350D: 50 V, 3 A PNP low VCEsat (BISS) transistor

PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package. NPN complement: PBSS4350D

SOT457

Data Sheets (1)

Name/Description	Modified Date
50 V, 3 A PNP low VCEsat (BISS) transistor (REV 6.0) PDF (253.0 kB) PBSS5350D	30 Jun 2011

Application Notes (2)

Name/Description	Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076	12 Jul 2011
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405	06 Jan 2006

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457	08 Feb 2016

Packing (3)

Name/Description	Modified Date
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115	30 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125	30 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT457_135	30 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
PBSS5350D NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5350D_1	31 Jan 2015
PBSS5350D NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5350D_NXP_PRODUCT_QUALITY	31 Jan 2015

Supporting Information (3)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457	03 Jun 2013

Ordering Information

Product	Status	Package version	Package name	Size (mm)	Transistor polarity	transistor polarity	P_tot [max] (mW)	number of transistors	V_CEO [max] (V)	I_C [max] (A)	I_CM [max] (A)	h_FE [min]	h_FE [typ]	f_T [typ] (MHz)	f_T [min] (MHz)	R_CEsat [typ] (mΩ)	V_CEsat [max] (mV)	R_CEsat [max] (mΩ)
PBSS5350D	Active	SOT457	TSOP6	2.9 x 1.5 x 1		PNP	600	1	-50	-3	-5	200			100	120	-100	150
PBSS5350D/DG	No Longer Manufactured	SOT457	TSOP6	2.9 x 1.5 x 1		PNP	600		-50	-3	-5	200				120	-100

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
PBSS5350D		SOT457	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	PBSS5350D,115 (9340 559 46115)	53	PBSS5350D		week 22, 2003	153.0	0.71	1.41E9	1	1
				Reel 11¼" Q1/T1 in LargePack	Active	PBSS5350D,135 (9340 559 46135)	53	PBSS5350D		week 22, 2003	153.0	0.71	1.41E9	1	1
				Reel 7" Q3/T4, Reverse	Active	PBSS5350D,125 (9340 559 46125)	53	PBSS5350D		Always Pb-free	153.0	0.71	1.41E9	1	1

50 V, 3 A PNP low VCEsat (BISS) transistor PBSS5350D

Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z

Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16

PBSS5350D NXP® Product Reliability PBSS5350D

PBSS5350D NXP Product Quality PBSS5350D

MAR_SOT457 Topmark 74LVC2G17_Q100

PBSS5350D SPICE model PBSS5350D

PBSS5350D_1_2_3_4 PBSS5350D

plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud

Tape reel SMD; standard product orientation 12NC ending 135 bza456a

Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100

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