PBSS5612PA: 12 V, 6 A PNP low VCEsat (BISS) transistor
PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.
NPN complement: PBSS4612PA.
Outline 3d SOT1061
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 12 V, 6 A PNP low V_CEsat (BISS) transistor (REV 1.0) PDF (155.0 kB) PBSS5612PA [English] | 31 May 2010 |
Application Notes (2)
| Name/Description | Modified Date |
|---|---|
| Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 [English] | 04 Mar 2013 |
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English] | 07 Nov 2012 |
Reliability and Quality Information (1)
| Name/Description | Modified Date |
|---|---|
| PBSS5612PA NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5612PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PBSS5612PA SPICE model (REV 1.4) prm PBSS5612PA_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Transistor polarity | transistor polarity | number of transistors | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | RCEsat [typ] (mΩ) | RCEsat [max] (mΩ) | VCEsat [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5612PA | Active | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | PNP | 1 | 2100 | -12 | -6 | -7 | 220 | 335 | 40 | 60 | 33 | 50 | -300 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5612PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PBSS5612PA,115 (9340 634 94115) | A9 | PBSS5612PA |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- 12 V, 6 A PNP low V_CEsat (BISS) transistor PBSS5612PA
- Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS5612PA NXP Product Quality PBSS5612PA
- PBSS5612PA SPICE model PBSS5612PA
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- PTVSXU1UPA_SERIES
