PBSS8110Z: 100 V, 1 A NPN low VCesat (BISS) transistor
NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT223 (SC-73) small Surface-Mounted Device (SMD) plastic package.
PNP complement: PBSS9110Z.
PBSS8110Z: Product Block Diagram
PBSS8110Z: Block Diagram
SOT223
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 100 V, 1 A NPN low VCesat (BISS) transistor (REV 2.0) PDF (147.0 kB) PBSS8110Z | 08 Jan 2007 |
Application Notes (2)
| Name/Description | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 | 06 Jan 2006 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS8110Z NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS8110Z_1 | 31 Jan 2015 |
| PBSS8110Z NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS8110Z_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PBSS8110Z SPICE model (REV 1.4) prm PBSS8110Z_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Transistor polarity | transistor polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS8110Z | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 650 | 1 | 100 | 1 | 3 | 150 | 100 | 160 | 200 | 200 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS8110Z | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | PBSS8110Z,135 (9340 579 77135) | PB8110 | PBSS8110Z |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- PBSS8110Z NXP® Product Reliability PBSS8110Z
- PBSS8110Z NXP Product Quality PBSS8110Z
- PBSS8110Z SPICE model PBSS8110Z
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- PBHV9115Z
- BLT81
