The PCF8576D is a peripheral device which interfaces to almost any Liquid Crystal Display (LCD) with low multiplex rates. It generates the drive signals for any static or multiplexed LCD containing up to four backplanes and up to 40 segments. It can be easily cascaded for larger LCD applications. The PCF8576D is compatible with most microcontrollers and communicates via the two-line bidirectional I²C-bus. Communication overheads are minimized by a display RAM with auto-incremented addressing, by hardware subaddressing and by display memory switching (static and duplex drive modes).
Name/Description | Modified Date |
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40 × 4 universal LCD driver for low multiplex rates (REV 15.0) PDF (454.0 kB) PCF8576D | 12 Feb 2015 |
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EMC and system level ESD design guidelines for LCD drivers (REV 1.0) PDF (910.0 kB) AN11267 | 06 Mar 2015 |
Cascading NXP® LCD segment drivers (REV 1.0) PDF (766.0 kB) AN11494 | 06 Mar 2015 |
Design guidelines for COG modules with NXP® monochrome LCD drivers (REV 4.0) PDF (205.0 kB) AN10170 | 04 Aug 2014 |
ESD and EMC sensitivity of IC (REV 1.0) PDF (745.0 kB) AN10853 | 14 Mar 2013 |
Handling bare die (REV 2.0) PDF (1.6 MB) AN10706 | 16 Jun 2011 |
Name/Description | Modified Date |
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Store and transport requirements (REV 3.0) PDF (325.0 kB) UM10569 | 10 Mar 2015 |
I2C-bus specification and user manual (REV 6.0) PDF (1.4 MB) UM10204 | 28 Apr 2014 |
I2C-bus specification and user manual (REV 5.0) PDF (1.6 MB) UM10204_JA | 03 Apr 2013 |
I2C Demonstration Board 2005-1 Quick Start Guide (REV 1.0) PDF (261.0 kB) UM10206 | 13 Jun 2006 |
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NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns (REV 1.0) PDF (3.5 MB) 75017540 | 01 Aug 2014 |
Touch-sensitive segmented 4 x 40 display (REV 1.0) PDF (501.0 kB) 75017454 | 08 Aug 2013 |
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543 | 01 Jun 2008 |
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Chip-On-Glass (COG) - a cost-effective and reliable technology for LCD displays (REV 2.0) PDF (1.2 MB) R_10015_1 | 12 Apr 2016 |
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Wire bond die; 59 bonding pads (REV 1.0) PDF (164.0 kB) OL-PCF8576DU_DA | 10 Feb 2016 |
plastic thin shrink small outline package; 56 leads; body width 6.1 mm (REV 1.0) PDF (506.0 kB) SOT364-1 | 08 Feb 2016 |
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TSSOP56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 4.0) PDF (248.0 kB) SOT364-1_118 | 15 Apr 2013 |
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Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE | 08 Oct 2009 |
Product | Package version | Max number of elements | Elements of MUX 1:1 | Elements of MUX 1:2 | Elements of MUX 1:3 | Elements of MUX 1:4 | AEC-Q100 compliant | I2C-bus | I2C speed | VDD1 [min] (V) | VDD1 [max] (V) | IDD [typ] (uA) | VLCD [min] (V) | VLCD [max] (V) | Tamb [min] (C) | Tamb [max] (C) | ffr (Hz) | Cascade for larger conf |
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Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PCF8576DU/2DA/2 | OL-PCF8576DU_DA | Die In Waffle Carriers 2" | Active | PCF8576DU/2DA/2,02 (9352 762 49026) | Standard Marking | PCF8576DU/2DA/2 | Always Pb-free | 5 | 2E8 | NA | NA | |||
PCF8576DU/DA/2 | OL-PCF8576DU_DA | Die In Waffle Carriers 2" | Active | PCF8576DU/DA/2,026 (9352 762 39026) | Standard Marking | PCF8576DU/DA/2 | Always Pb-free | 5 | 2E8 | NA | NA | |||
PCF8576DT/2 | SOT364-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | PCF8576DT/2,118 (9352 761 66118) | PCF8576DT | PCF8576DT/2 | Always Pb-free | 5 | 2E8 | 1 | 1 | ||
PCF8576DT/S400/2 | SOT364-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | PCF8576DT/S400/2,1 (9352 871 31118) | PCF8576DT/S400 | PCF8576DT/S400/2 | Always Pb-free | 5 | 2E8 | 1 | 1 |