NPN Resistor-Equipped Transistor (RET) family in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
Type number
R1
R2
Package NXP
NPN complement
PDTD113ZQA
1 kΩ
10 kΩ
DFN1010D-3
(SOT1215)
PDTB113ZQA
PDTD123YQA
2.2 kΩ
10 kΩ
PDTB123YQA
PDTD143XQA
4.7 kΩ
10 kΩ
PDTB143XQA
Switching loads
Name/Description | Modified Date |
---|---|
50 V, 500 mA NPN resistor-equipped transistors (REV 1.0) PDF (1.8 MB) PDTD113Z_123Y_143XQA_SER [English] | 31 Mar 2016 |
Name/Description | Modified Date |
---|---|
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English] | 08 Feb 2016 |
Name/Description | Modified Date |
---|---|
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IC [max] (mA) | R1 (typ) (kΩ) | R2 (typ) (kΩ) | channel type | Ptot (mW) | VCEO (V) |
---|---|---|---|---|---|---|---|---|---|---|
PDTD113ZQA | Active | SOT1215 | DFN1010D-3 | 1.1 x 1.0 x 0.37 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PDTD113ZQA | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | PDTD113ZQAZ (9340 692 72147) | Standard Marking | PDTD113ZQA | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |