PEMB30; PUMB30: PNP/PNP double resistor-equipped transistors; R1 = 2.2 kOhm, R2 = open
PNP/PNP double Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD) plastic packages
PEMB30_PUMB30: Product Block Diagram
SOT666
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| PNP/PNP double resistor-equipped transistors; R1 = 2.2 kOhm, R2 = open (REV 2.0) PDF (69.0 kB) PEMB30_PUMB30 [English] | 17 Sep 2009 |
Package Information (2)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 [English] | 08 Feb 2016 |
Packing (3)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 [English] | 29 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (180.0 kB) SOT666_315 [English] | 29 Nov 2012 |
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English] | 15 Nov 2012 |
Reliability and Quality Information (4)
| Name/Description | Modified Date |
|---|---|
| PEMB30 NXP Product Quality (REV 1.2) PDF (74.0 kB) PEMB30_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| PEMB30 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PEMB30_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| PUMB30 NXP® Product Quality (REV 1.1) PDF (74.0 kB) PUMB30_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| PUMB30 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PUMB30_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE model
- PEMB30 SPICE model (REV 1.4) prm PEMB30 7/22/2012
- PUMB30 SPICE model (REV 1.4) prm PUMB30 7/22/2012
Ordering Information
| Product | Status |
|---|---|
| PUMB30 | Active |
| PEMB30 | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PEMB30 | | SOT666 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PEMB30,315 (9340 599 27315) | 2T |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | PEMB30,115 (9340 599 27115) | 2T | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |||||
| PUMB30 |  | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PUMB30,115 (9340 599 33115) | Standard Marking | PUMB30 | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- PEMB30_PUMB30
- MAR_SOT363 Topmark BSS84AKS
- Letter Symbols - Transistors; General PEMD16
- Footprint for wave soldering SOT363 BFU520Y
- plastic surface-mounted package; 6 leads BFU520Y
- Footprint for reflow soldering SOT363 BFU520Y
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 pesd5v0l5uy
- TSSOP6; reel pack; reversed product orientation; 12NC ending 165 1PS88SB82
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 315 PEMH9
- Tape reel SMD; reversed product orientation 12NC ending 125 pesd5v0l5uv
- Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKV
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Footprint for reflow soldering SOT666 1PSXSB17
- plastic surface-mounted package; 6 leads 1PSXSB17
