Unidirectional ElectroStatic Discharge (ESD) protection diodes in a SOD882 leadless ultra small Surface Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients.
Name/Description | Modified Date |
---|---|
Unidirectional ESD protection diodes (REV 3.0) PDF (292.0 kB) PESDXS1UL_SER | 01 Nov 2011 |
Name/Description | Modified Date |
---|---|
DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 | 08 Feb 2016 |
Name/Description | Modified Date |
---|---|
Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 | 07 Nov 2012 |
Name/Description | Modified Date |
---|---|
PESD3V3S1UL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3S1UL | 31 Jan 2015 |
PESD3V3S1UL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3S1UL_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Name/Description | Modified Date |
---|---|
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
---|---|---|---|---|---|---|---|---|---|---|---|
PESD3V3S1UL | Active | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | 1 | Unidirectional | 207 | 300 | 3.3 | 30 | 2 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PESD3V3S1UL | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD3V3S1UL,315 (9340 599 75315) | G1 | PESD3V3S1UL | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |