PESD3V3U1UL: Ultra low capacitance unidirectional ESD protection diodes
Ultra low capacitance unidirectional ElectroStatic Discharge (ESD) protection diodes in small Surface-Mounted Device (SMD) plastic packages designed to protect one signal line from the damage caused by ESD and other transients.
PESD3V3U1UL: Product Block Diagram
PESD3V3U1UL: Block Diagram
PESD3V3U1UL: Block Diagram
sod882_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Ultra low capacitance unidirectional ESD protection diodes (REV 1.0) PDF (89.0 kB) PESD3V3U1UA_UB_UL | 30 Oct 2008 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 75017664 | 03 Jul 2015 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD3V3U1UL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3U1UL | 31 Jan 2015 |
| PESD3V3U1UL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3U1UL_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PESD3V3U1UL SPICE model (REV 1.0) TXT PESD3V3U1UL_1 3/5/2014
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD3V3U1UL | Active | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | 1 | Unidirectional | 2.6 | 3.1 | 3.3 | 9 | 0.1 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD3V3U1UL | | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD3V3U1UL,315 (9340 629 49315) | XZ | PESD3V3U1UL |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- Application guide: ESD protection prtr5v0u2x
- PESD3V3U1UL NXP® Product Reliability pesd3v3u1ul
- PESD3V3U1UL NXP® Product Quality pesd3v3u1ul
- PESD3V3U1UL SPICE model PESD3V3U1UL
- DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
- PTVSXS1UR_SERIES
- PESD5V0X1BL
- 1PSXSB17
- 1PS10SB82
