Femtofarad bidirectional ElectroStatic Discharge (ESD) protection diode in a leadless ultra small SOD882 Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients. The combination of extremely low capacitance, high ESD maximum rating and ultra small package makes the device ideal for high-speed data line protection and antenna protection applications.
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Femtofarad bidirectional ESD protection diode (REV 3.0) PDF (131.0 kB) PESD5V0F1BL | 25 Oct 2011 |
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Protecting charger interfaces and typical battery charging topologies with external bypass transistors (REV 2.0) PDF (204.0 kB) AN10910 | 01 Jul 2011 |
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DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 | 07 Nov 2012 |
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PESD5V0F1BL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0F1BL_1 | 31 Jan 2015 |
PESD5V0F1BL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0F1BL_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
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PESD5V0F1BL | Active | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | 1 | Bidirectional | 0.4 | 0.55 | 5.5 | 10 | 0.1 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PESD5V0F1BL | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD5V0F1BL,315 (9340 628 06315) | ZZ | PESD5V0F1BL | Always Pb-free | 159.0 | 0.74 | 1.35E9 | 1 | 1 |