Low capacitance unidirectional fivefold ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) plastic packages designed to protect up to five unidirectional signal lines from the damage caused by ESD and other transients.
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Low capacitance unidirectional fivefold ESD protection diode arrays (REV 2.0) PDF (106.0 kB) PESDXL5UF_V_Y | 08 Jan 2008 |
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MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 | 30 Dec 2010 |
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XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 | 08 Feb 2016 |
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XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 | 23 Apr 2013 |
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PESD5V0L5UF NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0L5UF | 31 Jan 2015 |
PESD5V0L5UF NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0L5UF_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 | 03 Jun 2013 |
Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
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PESD5V0L5UF | Active | SOT886 | XSON6 | 1.45 x 1 x 0.5 | 5 | Unidirectional | 16 | 19 | 5 | 20 | 0.025 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PESD5V0L5UF | SOT886 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD5V0L5UF,115 (9340 611 99115) | A2 | PESD5V0L5UF | Always Pb-free | 244.0 | 1.13 | 8.85E8 | 1 | 1 |