PESD5V0S1ULD: Unidirectional ESD protection diode
Unidirectional ElectroStatic Discharge (ESD) protection diode designed to protect one signal line from the damage caused by ESD and other transients. The device is housed in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
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Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Unidirectional ESD protection diode (REV 1.0) PDF (276.0 kB) PESD5V0S1ULD | 22 Oct 2010 |
Brochures (2)
| Name/Description | Modified Date |
|---|---|
| NXP® SOD882D package, First leadless package with tin-plated, solderable side pads (REV 2.0) PDF (1.8 MB) 75017130 | 06 Jun 2011 |
| The first leadless package with solderable side pads (REV 1.0) PDF (228.0 kB) POSTER_SOD882D | 21 Oct 2010 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D | 08 Feb 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD5V0S1ULD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0S1ULD_1 | 31 Jan 2015 |
| PESD5V0S1ULD NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0S1ULD_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PESD5V0S1ULD SPICE model (REV 1.1) prm PESD5V0S1ULD_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0S1ULD | Active | SOD882D | DFN1006D-2 | 1 x 0.6 x 0.4 | 1 | Unidirectional | 152 | 200 | 5 | 30 | 1 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0S1ULD | | SOD882D | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD5V0S1ULD,315 (9340 645 64315) | 0100 0000 | PESD5V0S1ULD |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- Unidirectional ESD protection diode pesd5v0s1uld
- NXP® SOD882D package, First leadless package with tin-plated, solderable side pads pesd5v0s1uld
- The first leadless package with solderable side pads pesd5v0s1uld
- PESD5V0S1ULD NXP® Product Reliability pesd5v0s1uld
- PESD5V0S1ULD NXP® Product Quality pesd5v0s1uld
- PESD5V0S1ULD SPICE model PESD5V0S1ULD
- DFN1006D-2: leadless ultra small plastic package; 2 terminals pesd5v0x1uld
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- BB187LX
