Ultra low capacitance bidirectional quadruple ElectroStatic Discharge (ESD) protection arrays in ultra small Surface-Mounted Device (SMD) plastic packages designed to protect up to four signal lines from the damage caused by ESD and other transients.
Name/Description | Modified Date |
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Ultra low capacitance bidirectional quadruple ESD protection arrays (REV 1.0) PDF (83.0 kB) PESD5V0U4BF_PESD5V0U4BW | 15 Aug 2008 |
Name/Description | Modified Date |
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plastic surface-mounted package; 5 leads (REV 1.0) PDF (186.0 kB) SOT665 | 08 Feb 2016 |
Name/Description | Modified Date |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (235.0 kB) SOT665_115 | 03 Dec 2012 |
Name/Description | Modified Date |
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PESD5V0U4BW NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U4BW | 31 Jan 2015 |
PESD5V0U4BW NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U4BW_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
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PESD5V0U4BW | Active | SOT665 | SOT665 | 1.6 x 1.2 x 0.55 | 4 | Bidirectional | 2.9 | 3.5 | 5 | 10 | 0.1 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PESD5V0U4BW | SOT665 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD5V0U4BW,115 (9340 619 53115) | A6 | PESD5V0U4BW | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |