PESD5V0U5BF; PESD5V0U5BV: Ultra low capacitance bidirectional fivefold ESD protection arrays
Ultra low capacitance bidirectional fivefold ElectroStatic Discharge (ESD) protection arrays in ultra small Surface-Mounted Device (SMD) plastic packages designed to protect up to five signal lines from the damage caused by ESD and other transients.
PESD5V0U5BF_PESD5V0U5BV: Product Block Diagram
PESD5V0U5BF_PESD5V0U5BV: Block Diagram
PESD5V0U5BF_PESD5V0U5BV: Block Diagram
SOT666
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Ultra low capacitance bidirectional fivefold ESD protection arrays (REV 1.0) PDF (83.0 kB) PESD5V0U5BF_PESD5V0U5BV [English] | 15 Aug 2008 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English] | 30 Dec 2010 |
Package Information (2)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 [English] | 08 Feb 2016 |
| XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English] | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English] | 23 Apr 2013 |
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 [English] | 29 Nov 2012 |
Reliability and Quality Information (4)
| Name/Description | Modified Date |
|---|---|
| PESD5V0U5BF NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U5BF [English] | 31 Jan 2015 |
| PESD5V0U5BF NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U5BF_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| PESD5V0U5BV NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U5BV [English] | 31 Jan 2015 |
| PESD5V0U5BV NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U5BV_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English] | 03 Jun 2013 |
SPICE model
- PESD5V0U5BV SPICE Model (REV 1.0) TXT PESD5V0U5BV_1 12/8/2015
Ordering Information
| Product | Status |
|---|---|
| PESD5V0U5BV | Active |
| PESD5V0U5BF | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0U5BV | | SOT666 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD5V0U5BV,115 (9340 619 54115) | G7 | PESD5V0U5BV |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
| PESD5V0U5BF |  | SOT886 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD5V0U5BF,115 (9340 619 67115) | B2 | PESD5V0U5BF | | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- MicroPak soldering information NTS0102_Q100
- PESD5V0U5BF NXP® Product Reliability pesd5v0u5bf
- PESD5V0U5BF NXP® Product Quality pesd5v0u5bf
- PESD5V0U5BV NXP® Product Reliability pesd5v0u5bv
- PESD5V0U5BV NXP® Product Quality pesd5v0u5bv
- MAR_SOT886 Topmark prtr5v0u2f
- PESD5V0U5BV SPICE Model PESD5V0U5BV
- plastic surface-mounted package; 6 leads BSS84AKV
- Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKV
- XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f
- PRTR5V0U2F_PRTR5V0U2K
- 1PSXSB17
- PESD5V0U5BF_PESD5V0U5BV
- 1PSXSB17
- BGU8007
