PESD5V0V1BLD: Very low capacitance bidirectional ESD protection diode

Very low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode designed to protect one signal line from the damage caused by ESD and other transients. The device is housed in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

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Data Sheets (1)

Name/Description	Modified Date
Very low capacitance bidirectional ESD protection diode (REV 1.0) PDF (165.0 kB) PESD5V0V1BLD	10 Dec 2010

Brochures (1)

Name/Description	Modified Date
Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 75017664	03 Jul 2015

Package Information (1)

Name/Description	Modified Date
DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D	08 Feb 2016

Reliability and Quality Information (2)

Name/Description	Modified Date
PESD5V0V1BLD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0V1BLD_1	31 Jan 2015
PESD5V0V1BLD NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0V1BLD_NXP_PRODUCT_QUALITY	31 Jan 2015

Supporting Information (1)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013

SPICE model

PESD5V0V1BLD SPICE model (REV 1.1) prm PESD5V0V1BLD_1_2 7/22/2012

Ordering Information

Product	Status	Package version	Package name	Size (mm)	No of protected lines	Configuration	C_d [typ] (pF)	C_d [max] (pF)	V_RWM (V)	V_ESD IEC61000-4-2 (kV)	I_RM [max] (µA)
PESD5V0V1BLD	Active	SOD882D	DFN1006D-2	1 x 0.6 x 0.4	1	Bidirectional	11	13	5	30	0.01

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
PESD5V0V1BLD		SOD882D	Reflow_Soldering_Profile	Reel 7" Q1/T1 Pitch 2mm	Active	PESD5V0V1BLD,315 (9340 652 43315)	0111 0000	PESD5V0V1BLD		Always Pb-free	117.0	0.54	1.85E9	1	1