PMEG2010AEJ: 20 V, 1 A very low V_F MEGA Schottky barrier rectifier in SOD323F package
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) very small and flat lead Surface Mounted Device (SMD) plastic package.
PMEG2010AEJ: Product Block Diagram
PMEG2010AEJ: Block Diagram
sod323f_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 20 V, 1 A very low V_F MEGA Schottky barrier rectifier in SOD323F package (REV 3.0) PDF (104.0 kB) PMEG2010AEJ | 26 Jan 2010 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (175.0 kB) SOD323F | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (180.0 kB) SOD323F_115 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMEG2010AEJ NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG2010AEJ_1 | 31 Jan 2015 |
| PMEG2010AEJ NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG2010AEJ_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PMEG2010AEJ SPICE model (REV 1.4) prm PMEG2010AEJ_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG2010AEJ | Active | SOD323F | SOD323F | 1.7 x 1.25 x 0.7 | 1 | 20 | single | 0,05@VR=15V | 10 | 50@VR=1V | 550@IF=1A |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG2010AEJ | | SOD323F | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG2010AEJ,115 (9340 590 06115) | EM | PMEG2010AEJ |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMEG2010AEJ NXP® Product Reliability PMEG2010AEJ
- PMEG2010AEJ NXP® Product Quality PMEG2010AEJ
- PMEG2010AEJ SPICE model PMEG2010AEJ
- plastic surface-mounted package; 2 leads pesd5v0s1uj
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 115 pesd5v0s1uj
- PESD5V0S1UJ_PESD12VS1UJ
- 1PSXSB17
- PESD5V0S1UJ_PESD12VS1UJ
