PMEG2015EPK: 20 V, 1.5 A low VF MEGA Schottky barrier rectifier
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 (DFN1608D-2) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
SOD1608
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 20 V, 1.5 A low VF MEGA Schottky barrier rectifier (REV 1.0) PDF (1.1 MB) PMEG2015EPK [English] | 06 Mar 2012 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN11470 [English] | 06 Mar 2015 |
Brochures (2)
| Name/Description | Modified Date |
|---|---|
| 适用于便携设备和移动电话... (REV 1.0) PDF (4.9 MB) 939775017444_ZH [English] | 28 Oct 2013 |
| Discretes for portable devices and mobile handsets (REV 1.1) PDF (3.9 MB) 939775017444 [English] | 04 Sep 2013 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
Package Information (2)
| Name/Description | Modified Date |
|---|---|
| DFN1608D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (179.0 kB) SOD1608 [English] | 08 Feb 2016 |
| SOD1608 (REV -) GIF (3.0 kB) SOD1608_SV_1 [English] |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMEG2015EPK NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG2015EPK_1 [English] | 31 Jan 2015 |
| PMEG2015EPK NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG2015EPK_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PMEG2015EPK SPICE model (REV 1.0) TXT PMEG2015EPK_1_2_3 5/10/2016
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | Remark |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG2015EPK | Active | SOD1608 | DFN1608D-2 | 1.6 x 0.8 x 0.37 | 1 | 20 | single | 420@IF=1,5A | 5 | 105@VR=1V | 0,9@VR=20V | solderable side pads |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG2015EPK | | SOD1608 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PMEG2015EPK,315 (9340 653 82315) | 1100 0000 | PMEG2015EPK |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
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- 适用于便携设备和移动电话... ptvsxs1ur_automotive
- Discretes for portable devices and mobile handsets ptvsxs1ur_automotive
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- SOD1608 PMEG4020EPK
- PMEG2015EPK NXP® Product Reliability PMEG2015EPK
- PMEG2015EPK NXP® Product Quality PMEG2015EPK
- PMEG2015EPK SPICE model PMEG2015EPK
- DFN1608D-2: leadless ultra small plastic package; 2 terminals PMEG4020EPK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN1608D_2_SCHOTTKY_RECTIFIER_SERIES
